2G HTS Wire Specification

Basic information about our REBCO 2G HTS wires is given below.

Basic Specification

Substrate thickness

50 µm, or 30 µm (25 µm under development)

Width

12, 6, 4, 3, or 2 mm (1.5 mm under development)

Piece length

Typically, 300 m to 500 m (up to more than 900 m)

Stabilizer

Ag only – Type SF (Stabilizer Free), or

Ag plus electroplated Cu – Type SCS (Surround Cu Stabilizer)

Electroplated Cu stabilizer thickness

10 µm to 110 µm total (5 µm to 55 µm per side)

Critical current (essentially proportional to the width, determined using 1 µV/cm criterion)

Ic (77K, self-field)

Typically, 130~150 A/4mm        

In-field critical current at various temperatures

See chart below

 

Mechanical properties

Axial tensile strength

(at 77K, self-field, for 95% original Ic retention)

Depending on substrate thickness

(550 MPa for wires on 50 µm thick substrate with total 40 µm Cu stabilizer)

Minimum bending diameter

(at 77K, self-field, for 95% original Ic retention)

11 mm for wires on 50 µm thick substrate

6 mm for wires on 30 µm thick substrate

 

Other options

Joint

Soldered lap joint, for Type SCS wires

(joint resistivity ~ 40 nΩ-cm2 at 77K)

Insulation

Wrapped 25 µm thick polyimide tape (butt wrapping or 30% overlapping)

Electroplated solder coating

5 µm to 10 µm per side on Type SCS wires